The thickness of thermal paste materials is represented by T, S is the contact area, and λ is the thermal paste. By substituting the values into the formula, we can get the thermal resistance value θ of thermal paste materials. If the thermal resistance is larger, the heat paste resistance of the material will be higher, and the corresponding thermal cpaste efficiency will be lower. For the cooling system of electronic products, the impact of excessive thermal resistance between the heat source and the heat sink is very large. This is why thermal paste materials must be used as the conduction medium in the cooling system of electronic products. A good thermal paste material can minimize the thermal resistance between the heat source and the heat sink, thereby greatly improving the heat dissipation efficiency.
There are very fine uneven gaps between the surface of microelectronic materials and the heat sink. If they are directly installed together, the actual contact area between them is only 10% of the area of the heat sink base, and the rest is air gap. it is a poor conductor of heat, which will lead to a very large contact thermal resistance between electronic components and radiators, seriously hindering the conduction of heat, and ultimately causing low efficiency of the radiator.
Filling these gaps with high thermal paste materials, excluding the air in them, and establishing an effective heat conduction channel between electronic components and radiators can greatly increase the effective contact area between the heat source and the radiator, reduce the contact thermal resistance, and fully play the role of the radiator.
Although thermal paste materials only exist in the form of auxiliary materials in electronic products, they have successfully solved the heat dissipation problem of electronic products, thereby greatly improving the reliability, stability and service life of electronic products, and becoming an indispensable part of electronic products.
