When choosing the right amount of thermal paste, it’s crucial to carefully balance filling efficiency and heat dissipation performance. Thermal paste, as an interface filler, is primarily used to fill tiny gaps and improve thermal conductivity.
However, if applied too thickly, it can act as a gap filler. Once the grease dries, thermal resistance increases significantly, leading to decreased thermal conductivity and potentially impacting device stability. Therefore, the correct amount is crucial.
According to Intel’s official recommendations, the amount of thermal paste applied to the CPU should be 0.3 ml, about the size of a pea (see the image below). For smooth contact surfaces, a thickness of no more than 0.2 mm is recommended.
